Currently, oxidation reaction, poor wettability and high peak temperature in reflow soldering will do harm to electronic solder joints. To offset these effects, using nitrogen to inert the atmosphere during soldering has become a globally accepted practice in electronic assembly. Nitrogen atmosphere improves the wettability of solder, reduces the degree of oxidation, and accelerates the speed of soldering reaction.
Whatever you need to control the atmosphere within your reflow ovens and simultaneously decrease nitrogen costs, Nexelia for Reflow Soldering is the unrivalled option.
A complete retrofit solution, Nexelia for Reflow Soldering is designed by Air Liquide to generate and carefully monitor inert atmosphere into your reflow oven. The solution combines nitrogen supply with an automated controlling system to automatically adjust the inert atmosphere composition in the reflow oven.
A comprehensive gas solution designed for and adapted to your specific needs, Nexelia for Reflow Soldering combines the best of our gases, application technologies and expert support. As with all solutions under the Nexelia label, we work closely with you to pre-define a concrete set of results, and we commit to delivering them.
Nexelia for Reflow Soldering is for the sectors within the electronic- manufacturing industry that use reflow soldering process.